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6H N Type SiC Wafer Dummy Grade C 0001 Bulk Crystal Growth <50 Arcsec FWHM

6H N Type SiC Wafer Dummy Grade C 0001 Bulk Crystal Growth <50 Arcsec FWHM

6H N Type SiC Wafer Dummy Grade C 0001 Bulk Crystal Growth <50 Arcsec FWHM

Product Details:

Place of Origin: China
Brand Name: PAM-XIAMEN

Payment & Shipping Terms:

Minimum Order Quantity: 1-10,000pcs
Price: By Case
Delivery Time: 5-50 working days
Payment Terms: T/T
Supply Ability: 10,000 wafers/month
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Detailed Product Description
Grade: Dummy Grade Name: 6H N Type SIC Wafer
Application: Researcher Description: Semiconductor Silicon Carbide Wafer
Size: 10mm X 10mm Keywords: SiC Wafer
Diameter: (50.8 ± 0.38) Mm Dopant: Nitrogen
High Light:

4h sic wafer


sic wafer

C(0001) 6H N Type SiC Wafer , Dummy Grade , 10mm x 10mm


Here shows detail specification:


Polytype Single Crystal 4H Single Crystal 6H
Lattice Parameters a=3.076 Å a=3.073 Å
  c=10.053 Å c=15.117 Å
Stacking Sequence ABCB ABCACB
Band-gap 3.26 eV 3.03 eV
Density 3.21 · 103 kg/m3 3.21 · 103 kg/m3
Therm. Expansion Coefficient 4-5×10-6/K 4-5×10-6/K
Refraction Index no = 2.719 no = 2.707
  ne = 2.777 ne = 2.755
Dielectric Constant 9.6 9.66
Thermal Conductivity 490 W/mK 490 W/mK
Break-Down Electrical Field 2-4 · 108 V/m 2-4 · 108 V/m
Saturation Drift Velocity 2.0 · 105 m/s 2.0 · 105 m/s
Electron Mobility 800 cm2/V·S 400 cm2/V·S
hole Mobility 115 cm2/V·S 90 cm2/V·S
Mohs Hardness ~9 ~9


6H N Type SiC Wafer, Dummy Grade,10mm x 10mm

Description Dummy Grade 6H SiC Substrate
Polytype 6H
Diameter (50.8 ± 0.38) mm
Thickness (250 ± 25) μm (330 ± 25) μm (430 ± 25) μm
Carrier Type n-type
Dopant Nitrogen
Resistivity (RT) 0.012 – 0.0028 Ω·cm
Surface Roughness < 0.5 nm (Si-face CMP Epi-ready); <1 nm (C- face Optical polish)
FWHM <50 arcsec
Micropipe Density A+≤1cm-2 A≤10cm-2 B≤30cm-2 C≤50cm-2 D≤100cm-2
Surface Orientation  
On axis <0001>± 0.5°
Off axis 4°or 8° toward <11-20>± 0.5°
Primary flat orientation Parallel {1-100} ± 5°
Primary flat length 16.00 ± 1.70) mm
Secondary flat orientation Si-face:90° cw. from orientation flat ± 5°
C-face:90° ccw. from orientation flat ± 5°
Secondary flat length 8.00 ± 1.70 mm
Surface Finish Single or double face polished
Packaging Single wafer box or multi wafer box
Usable area ≥ 90 %
Edge exclusion 1 mm


PAM-XIAMEN offers semiconductor silicon carbide wafers,6H SiC and 4H SiC in different quality grades for researcher and industry manufacturers. We has developed SiC crystal growth technology and SiC crystal wafer processing technology,established a production line to manufacturer SiCsubstrate,Which is applied in GaNepitaxydevice,powerdevices,high-temperature device and optoelectronic Devices. As a professional company invested by the leading manufacturers from the fields of advanced and high-tech material research and state institutes and China’s Semiconductor Lab,weare devoted to continuously improve the quality of currently substrates and develop large size substrates.


SiC crystal growth

Bulk crystal growth is the technique for fabrication of single crystalline substrates , making the base for further device processing.To have a breakthrough in SiC technology obviously we need production of SiC substrate with a reproducible process.6H- and 4H- SiC crystals are grown in graphite crucibles at high temperatures up to 2100—2500°C. The operating temperature in the crucible is provided either by inductive (RF) or resistive heating. The growth occurs on thin SiC seeds. The source represents polycrystalline SiC powder charge. The SiC vapor in the growth chamber mainly consists of three species, namely, Si, Si2C, and SiC2, which are diluted by carrier gas, for example, Argon. The SiC source evolution includes both time variation of porosity and granule diameter and graphitization of the powder granules.


SiC MicroElectromechanical Systems (MEMS) and Sensors


For applications requiring high temperature, low-leakage SiC electronics not possible with SiC layers deposited on silicon (including high-temperature transistors, as discussed in Section 5.6.2), concepts for integrating much more capable electronics with MEMS on 4H/6H SiC wafers with epilayers have also been proposed. For example, pressure sensors being developed for use in higher temperature regions of jet engines are implemented in 6H-SiC, largely owing to the fact that low junction leakage is required to achieve proper sensor operation . On-chip 4H/6H integrated transistor electronics that beneficially enable signal conditioning at the high-temperature sensing site are also being developed . With all micromechanical-based sensors, it is vital to package the sensor in a manner that minimizes the imposition of thermomechanical induced stresses (which arise owing to thermal expansion coefficient mismatches over much larger temperature spans enabled by SiC) onto the sensing elements. Therefore (as mentioned previously in Section 5.5.6), advanced packaging is almost as critical as the use of SiC toward usefully expanding the operational envelope of MEMS in harsh environments.


As discussed in Section 5.3.1, a primary application of SiC harsh-environment sensors is to enable active monitoring and control of combustion engine systems to improve fuel efficiency while reducing pollution. Toward this end, SiC’s high-temperature capabilities have enabled the realization of catalytic metal–SiC and metal-insulator–SiC prototype gas sensor structures with great promise for emission monitoring applications and fuel system leak detection . High-temperature operation of these structures, not possible with silicon, enables rapid detection of changes in hydrogen and hydrocarbon content to sensitivities of parts per million in very small-sized sensors that could easily be placed unobtrusively on an engine without the need for cooling. However, further improvements to the reliability, reproducibility, and cost of SiC-based gas sensors are needed before these systems will be ready for widespread use in consumer automobiles and aircraft. In general, the same can be said for most SiC MEMS, which will not achieve widespread beneficial system insertion until high reliability in harsh environments is assured via further technology development.


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