2009, PAM-XIAMEN develop GaN technology, integrate GaN crystal substrate, epitaxy and RF& Power& LED device. It has become an integration of the R & D, design, production and sales of semiconductor materials, epitaxy, devices and modules, and connecting the whole industry chain of the third generation of semiconductors including GaN material and SiC material,

incubating VCSEL, power electronic devices, compound semiconductor RF devices, lamp packaging modules Laser packaging module and other international cutting-edge technologies.

2007, PAM-XIAMEN offer epi service based on III-V substrate (including GaAs substrate, GaSb substrate, InSb substrate,InAs substrate and InP substrate,GaN substrate, AlN substrate), material covers GaInSb,InAs,AlSb,GaInNasSb,InGaAs,AlGaAs,InGaAsP,AlInGaAs,GaAlAs,InGaAlP,AlGaInP,InGaP, InGaN, AlGaN, application includes Power &RF, Photonics, LED, solar cell and Electronics.

2004, PAM-XIAMEN offers semiconductor SiC wafers with 6H SiC and 4H SiC wafer in different quality grades for researcher and industry manufacturers. We has developed whole production line with SiC crystal growth technology and SiC wafer processing technology,size from 2” to 6”. We provide custom thin film (silicon carbide)SiC epitaxy on 6H or 4H substrates for the development of silicon carbide devices. SiC epi wafer is mainly used for Schottky diodes, metal-oxide semiconductor field-effect transistors, junction field effect.

From 2001, we develop and produce Germanium material including Germanium wafer which is for micro-electronics, optical application and solar cell.

From 1990, we devote to research and produce CZ silicon wafer and ingot, after a decade, we develop FZ silicon wafer with >1000 ohm.cm. and now we can offer wafer size from 2” to 12” with prime grade and test grade.

PAM-XIAMEN offer wafer technology consultant service with our 29+ experience in semiconductor material, we know how to connect knowledge from substrate, epitaxy to device, and we know how to choose or grow the right and qualified substrate for you when you use it for expitaxy or other application, we also know how to adjust wafer structure for different device.

PAM-XIAMEN offer qualified semiconductor wafer and wafer technology consultant service with our 29+ experience in semiconductor material from front end to back end, we know how to connect knowledge from substrate, epitaxy to device, and we know how to choose or grow the right and qualified substrate for you when you use it for expitaxy or other application, we also know how to adjust wafer structure for different device and grow the right structures for you.

Production team, who are responsible for controlling the whole production line from growth of ingot to packing.

Technology team, who are from production dept, always offer technology support from enquiry to after sales.

Sales&marketing team, who are responsible for marketing and sell products, there are sales engineers members at front end, administration members to deal with documents and shipments, website supporters.

R&D team, who is focusing on research and development and applied research (compared with basic research).

Purchasing team, who are responsible for buying machine, equipment and material

Accounting team, who belong to head office.