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3 Inch InP Indium Phosphide Wafer Prime Grade For Electronic Photonic Devices

3 Inch InP Indium Phosphide Wafer Prime Grade For Electronic Photonic Devices

3 Inch InP Indium Phosphide Wafer Prime Grade For Electronic Photonic Devices

Product Details:

Place of Origin: China
Brand Name: PAM-XIAMEN

Payment & Shipping Terms:

Minimum Order Quantity: 1-10,000pcs
Packaging Details: Packaged in a class 100 clean room environment, in single container, under a nitrogen atmosphere
Delivery Time: 5-50 working days
Payment Terms: T/T
Supply Ability: 10,000 wafers/month
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Detailed Product Description
Dopant: Iron Product Name: InP Wafer
Wafer Diamter: 3 Inch Grade: Prime Grade
Conduction Type: Semi Insulating Application: Optoelectronics
Keyword: High Purity Indium Phosphide Wafer Wafer Thickness: 600±25um

Semi-Insulating , InP Wafer , 3”, Prime Grade, For Electronic And Photonic Devices

 

Semi-Insulating, InP Wafer, 3”, Prime Grade

3"InP Wafer Specification      
Item Specifications
Conduction Type SI-type
Dopant Iron
Wafer Diameter 3"
Wafer Orientation 100±0.5°
Wafer Thickness 600±25um
Primary Flat Length 8±1mm
Secondary Flat Length 8±1mm
Carrier Concentration ≤3x1016cm-3 (0.8-6)x1018cm-3 (0.6-6)x1018cm-3 N/A
Mobility (3.5-4)x103cm2/V.s (1.5-3.5)x103cm2/V.s 50-70cm2/V.s >1000cm2/V.s
Resistivity N/A N/A N/A >0.5x107Ωcm
EPD <1000cm-2 <500cm-2 <1x103cm-2 <5x103cm-2
TTV <12um
BOW <12um
WARP <12um
Laser Marking upon request
Suface Finish P/E, P/P
Epi Ready yes
Package Single wafer container or cassette

 

Impact Ionization

3 Inch InP Indium Phosphide Wafer Prime Grade For Electronic Photonic Devices The dependence of ionization rates for electrons αi and holes βi versus 1/F, 300 K.
(Cook et al. [1982]).
3 Inch InP Indium Phosphide Wafer Prime Grade For Electronic Photonic Devices Breakdown voltage and breakdown field versus doping density for an abrupt p-n junction, 300 K
(Kyuregyan and Yurkov [1989]).

 

Wafer Cleaning

Wafer cleaning is an integral part of the wafer industry. The cleaning process involves the removal of particulate and chemical impurities from the semiconductor. It’s imperative during the cleaning process that the substrate is not damaged in any way. Wafer cleaning is ideal for silicon-based materials since it’s the most common element that is used. Some of the benefits of wafer cleaning include:

  • No damage to the silicon
  • Environmentally friendly
  • Safely and effectively removes any surface contaminants and imperfections
  • Enhances the performance of the wafer

Applications

The application fields of InP splits up into three main areas. It is used as the basis

- for optoelectronic components

- for high-speed electronics.

- for photovoltaics

 

Service

 

7X24-hour Telephone Consulting Service is available.

Reply and solution will be provided in 8 hours upon customer’s service request.

After-sales Support is available on a 7X24-hour basis, leaving no worries for customers.

 

Quality inspection from raw material to production, and delivery.

Professional quality control person, to avoid the unqualified products flowing to customer.

Strict inspection to Raw material, production, and delivery.

Full series of equipment in quality laboratory.

Contact Details
XIAMEN POWERWAY ADVANCED MATERIAL CO., LTD.
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