Place of Origin: | China |
Brand Name: | PAM-XIAMEN |
Minimum Order Quantity: | 1-10,000pcs |
---|---|
Price: | By Case |
Delivery Time: | 5-50 working days |
Payment Terms: | T/T |
Supply Ability: | 10,000 wafers/month |
Name: | Semi Insulating SiC Wafer | Keywords: | Single Crystal Silicon Carbide Wafer |
---|---|---|---|
Grade: | Dummy Grade | Description: | 4H SEMI Substrate |
Size: | 10mm X 10mm | Application: | Optoelectronic Industry |
Sable Area: | ≥ 90 % | Edge Exclusion: | 1 Mm |
High Light: | semi standard wafer,sic wafer |
4H Semi-Insulating Silicon Substrate, Dummy Grade,10mm x 10mm
2) Double side polished are preferred;
3) Surface roughness: < 2nm, so that the surface is enough flat for bonding;
7. SiC substrate for THz system application: Normally it require THz transparency
8. SiC substrate for epitaxial graphene on SiC:Graphene epitaxy on off axis substrate and on axis are both available, surface side on C-face or Si face are both available.
9. SiC substrate for process development loke ginding, dicing and etc
10. SiC substrate for fast photo-electric switch
Please contact us for more information
SILICON CARBIDE MATERIAL PROPERTIES
Polytype | Single Crystal 4H | Single Crystal 6H |
Lattice Parameters | a=3.076 Å | a=3.073 Å |
c=10.053 Å | c=15.117 Å | |
Stacking Sequence | ABCB | ABCACB |
Band-gap | 3.26 eV | 3.03 eV |
Density | 3.21 · 103 kg/m3 | 3.21 · 103 kg/m3 |
Therm. Expansion Coefficient | 4-5×10-6/K | 4-5×10-6/K |
Refraction Index | no = 2.719 | no = 2.707 |
ne = 2.777 | ne = 2.755 | |
Dielectric Constant | 9.6 | 9.66 |
Thermal Conductivity | 490 W/mK | 490 W/mK |
Break-Down Electrical Field | 2-4 · 108 V/m | 2-4 · 108 V/m |
Saturation Drift Velocity | 2.0 · 105 m/s | 2.0 · 105 m/s |
Electron Mobility | 800 cm2/V·S | 400 cm2/V·S |
hole Mobility | 115 cm2/V·S | 90 cm2/V·S |
Mohs Hardness | ~9 | ~9 |
4H Semi-Insulating Silicon Substrate, Dummy Grade,10mm x 10mm
SUBSTRATE PROPERTY | S4H-51-SI-PWAM-250 S4H-51-SI-PWAM-330 S4H-51-SI-PWAM-430 |
Description | Dummy Grade 4H SEMI Substrate |
Polytype | 4H |
Diameter | (50.8 ± 0.38) mm |
Thickness | (250 ± 25) μm (330 ± 25) μm (430 ± 25) μm |
Resistivity (RT) | >1E5 Ω·cm |
Surface Roughness | < 0.5 nm (Si-face CMP Epi-ready); <1 nm (C- face Optical polish) |
FWHM | <50 arcsec |
Micropipe Density | A+≤1cm-2 A≤10cm-2 B≤30cm-2 C≤50cm-2 D≤100cm-2 |
Surface Orientation | |
On axis <0001>± 0.5° | |
Off axis 3.5° toward <11-20>± 0.5° | |
Primary flat orientation | Parallel {1-100} ± 5° |
Primary flat length | 16.00 ± 1.70 mm |
Secondary flat orientation Si-face:90° cw. from orientation flat ± 5° | |
C-face:90° ccw. from orientation flat ± 5° | |
Secondary flat length | 8.00 ± 1.70 mm |
Surface Finish | Single or double face polished |
Packaging | Single wafer box or multi wafer box |
Usable area | ≥ 90 % |
Edge exclusion | 1 mm |
SiC crystal application
Many researchers know the general SiCapplication:III-V Nitride Deposition;OptoelectronicDevices;High Power Devices;High Temperature Devices;High Frequency Power Devices.But few people knows detail applications, We list some detail application and make some explanations.
Saturation Velocity:
Saturation velocity is the maximum velocity a charge carrier in a semiconductor, generally an electron, attains in the presence of very high electric fields[1]. Charge carriersnormally move at an average drift speed proportional to the electric field strength they experience temporally. The proportionality constant is known as mobility of the carrier, which is a material property. A good conductor would have a high mobility value for its charge carrier, which means higher velocity, and consequently higher current values for a given electric field strength. There is a limit though to this process and at some high field value, a charge carrier can not move any faster, having reached its saturation velocity, due to mechanisms that eventually limit the movement of the carriers in the material.
When designing semiconductor devices, especially on a sub-micrometre scale as used in modern microprocessors, velocity saturation is an important design characteristic.
4 Inch Indium Phosphide Wafer P Type Test Grade InP Epi Ready Wafer
Single Crystal Indium Phosphide Wafer High Purity 4 Inch Prime Grade
Fe Doped InP Test Grade Wafer 4" Semi Insulating Optical Sensing Application
2 Inch Gallium Nitride Wafer Bulk GaN Substrates For LED HEMT Structure
2 Inch GaN Gallium Nitride Substrates Freestanding High Frequency Devices Use
2 Inch Bulk U Gallium Nitride Wafer Epi Ready Wafer For GaN Laser Diode
6H N Type SiC Wafer Dummy Grade C 0001 Bulk Crystal Growth <50 Arcsec FWHM
On Axis Sic Silicon Carbide Wafer 4 Deg Off 4H N Type Production Grade
Research Grade Silicon Carbide Wafer 6H SiC Semi Standard Wafer Cmp Polished