Home ProductsSilicon Wafer

P Type 2 Inch Silicon Epi Wafer Boron Doped Monocrystalline Wafer

P Type 2 Inch Silicon Epi Wafer Boron Doped Monocrystalline Wafer

P Type 2 Inch Silicon Epi Wafer Boron Doped Monocrystalline Wafer

Product Details:

Place of Origin: China
Brand Name: PAM-XIAMEN

Payment & Shipping Terms:

Minimum Order Quantity: 1-10,000pcs
Price: By Case
Delivery Time: 5-50 working days
Payment Terms: T/T
Supply Ability: 10,000 wafers/month
Contact Now
Detailed Product Description
Product Name: Prime Grade Silicon Wafer Feature: Prime Grade
Dopant: P/As/Sb Wafer Thickness: Power Way
Other Name: Monocrystalline Wafer Wafer Diameter: 2 Inch
RRG: ≤15% Front Surface: Polished
High Light:

float zone wafer


epitaxial silicon wafer

2 Inch Silicon Wafer FZ P Type Boron Doped Orientation 111 Prime Grade 2"


2inch Silicon Wafer FZ P Type Boron Doped Orientation 111 Prime Grade 2"

Type Conduction Type Orientation Diameter(mm) Resistivity(Ω•cm)
High resistance N&P <100>&<111> 50 - 300 >1000
NTD N <100>&<111> 50 - 300 30-800
CFZ N&P <100>&<111> 50 - 300 1-50
GD N&P <100>&<111> 50 - 300 0.001-300


Parameter Unit Value
Crystalline structure - Monocrystalline
Growth technique - FZ
Crystal Orientation - 111
Conductance type - P
Dopant - Boron
Diameter mm 50
Resistivity Ω/cm2 >1000, 30-800, 1-50, 0.001-300
Thickness um 350±15um
TTV um ≤15 um
BOW um ≤40 um
Warp um ≤40 um
(G)STIR um Customer standard
Site Flatness-STIR um Customer standard
Edge Exclusion Zone mm SEMI STD or Customer Request
LPD's - ≥0.3μm, <30count or Customer Request
Oxygen Concentration ppma <1E16/cc
Carbon Concentration ppma <1E16/cc
RRG - ≤15%
Front Surface - Polished
Back Surface - Polished or Etched
Edge Surface Condition   SEMI STD or Customer Request
Primary Flat Length mm SEMI STD
Primary Flat Orientation(100/111) & Angle(°)   SEMI STD
Secondary Flat Length mm SEMI STD
Secondary Flat Orientation(100/111) & Angle(°)   SEMI STD
Laser mark - SEMI STD or Customer Request
Packaging   Packaged in a class 100 clean room environment,
Heat-sealed plastic inner/aluminium foil outer bags,
Vacuum Packing
If specific requirement by customer, will adjust accordingly



Found in 1990,Xiamen Powerway Advanced Material Co., Ltd (PAM-XIAMEN) is a leading manufacturer of semicon doctor semiconductor material in China. PAM-XIAMEN develops advanced crystal growth and epitaxy technologies, manufacturing processes, engineered substrates and semiconductor devices. PAM-XIAMEN’s technologies enable higher performance and lower cost manufacturing of semiconductor wafer. For almost 30 years, PAM-XIAMEN aims to manufacture monocrystalline silicon wafer from the pulling process to get the ingot up to the final step which is the cleaning process, and vertically integrating to epi growth(silicon epi wafer) . This production and epi growth flow allows to maintain a reliable and qualitative consistency. Welcome you to enquire our engineer team, and we will give you full technology support.


After the wafers have been sliced, the lapping process begins.


Cleaning:The final and most crucial step in the manufacturing process is polishing the wafer. This process takes place in a clean room. Clean rooms have a rating system that ranges from Class 1 to Class 10,000. These particles are not visible to the naked eye and in an uncontrolled atmosphere, the workers must wear clean room suits that cover their body from head to toe and do not collect or carry any particles.

Polishing:Most prime grade silicon wafers go through 2-3 stages of polishing, using progressively finer slurries or polishing compounds. The polishing process occurs in two steps, which are stock removal and final chemical mechanical polish (CMP). Both processes use polishing pads and polishing slurry. The stock removal process removes a very thin layer of silicon and is necessary to produce a wafer surface that is damage-free. After polishing, the silicon wafers proceed to a final cleaning stage that uses a long series of clean baths. This process removes surface particles, trace metals, and residues. Oftentimes a backside scrub is done to remove even the smallest particles.

Packaging:Once the wafers complete the final cleaning step, engineers sort them by specification and inspect them under high intensity lights or laser-scanning systems. This detects unwanted particles or other defects that may have occurred during fabrication. All wafers that meet the proper specifications are packaged in cassettes and sealed with tape. The wafers ship in a vacuum-sealed plastic bag with an airtight foil outer bag. This ensures that no particles or moisture enters the cassette upon leaving the clean room.




7X24-hour Telephone Consulting Service is available.

Reply and solution will be provided in 8 hours upon customer’s service request.

After-sales Support is available on a 7X24-hour basis, leaving no worries for customers.


Quality inspection from raw material to production, and delivery.

Professional quality control person, to avoid the unqualified products flowing to customer.

Strict inspection to Raw material, production, and delivery.

Full series of equipment in quality laboratory.


About Us


Continuous improvement, seeking higher quality level. Our highly dedicated sales staff has never shied away from going that extra mile to meet and exceed the customer’s expectations. We treat our customers with the same loyalty and devotion, no matter the size of their business or industry.


We have a clean and tidy, wide workshop and a production and development team with rich experience, providing strong support for your r&d and production needs!All of our products comply with international quality standards and are greatly appreciated in a variety of different markets throughout the world. If you are interested in any of our products or would like to discuss a custom order, please feel free to contact us. We are looking forward to forming successful business relationships with new clients around the world in the near future.

Contact Details
Send your inquiry directly to us (0 / 3000)

Other Products